djshowdown
31 Dec 2006, 01:01pm
im running a pentium 4, 3.0 ghz northwood processor
when i am funning FAH (2 instances) my cpu temp is around 63 and the case temp is about 42
now i have had my computer apart and removed the cpu fan/heatsink to clean it and i swear it runs hotter now than before
i am not 100% sure about this but im pretty sure it never ran this hot
is it possible that i need to re-apply thermal paste to create a better bond?
could i benefit from a better fan/heatsink?
i am currently running a zalman which i believe is the following
http://www.dabs.com/productview.aspx?Quicklinx=4C87&CategorySelectedId=11258&NavigationKey=11258,4294956808,50440
i would have thought it was sufficient
the system in question is the same system in my sig. if you guys need more system specs i can post them up
muchos gracias :thumbsup:
any thoughts?
when i am funning FAH (2 instances) my cpu temp is around 63 and the case temp is about 42
now i have had my computer apart and removed the cpu fan/heatsink to clean it and i swear it runs hotter now than before
i am not 100% sure about this but im pretty sure it never ran this hot
is it possible that i need to re-apply thermal paste to create a better bond?
could i benefit from a better fan/heatsink?
i am currently running a zalman which i believe is the following
http://www.dabs.com/productview.aspx?Quicklinx=4C87&CategorySelectedId=11258&NavigationKey=11258,4294956808,50440
i would have thought it was sufficient
the system in question is the same system in my sig. if you guys need more system specs i can post them up
muchos gracias :thumbsup:
any thoughts?