Zuntar
14 Apr 2007, 12:23pm
IBM is detailing a new breakthrough in three-dimensional chip-stacking technique that allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems. The company claims that the technology will extend Moore’s Law beyond its expected limits.
Hmmm, wonder how long before we see this technology used in say.... multi core chips? More here!! (http://www.dailytech.com/IBM+Stacking+Chips+for+Greater+Efficiency/article6905.htm)
Hmmm, wonder how long before we see this technology used in say.... multi core chips? More here!! (http://www.dailytech.com/IBM+Stacking+Chips+for+Greater+Efficiency/article6905.htm)