US memory maker Mushkin is showing a new line of DDR3 kits aimed squarely at Core i5 and Core i7 systems. Dubbed Copperhead, the new dual- and tri-channel kits run at 1.65V and cover a range of timings from 8/8/8 to 6/7/6.

The new DIMMs are also compatible with Mushkin’s swanky Copperhead water block, pictured above. For more details on the SKUs, prices and specs, go pay a visit to Fuad and friends over at Fudzilla.

Enthusiast memory vendor G.SKILL has released a new lineup of memory modules it calls the ECO series, but there’s nothing ECO about what we want to do with them.

The new DDR3 kits ship in a 2×2GB configuration, which means they’re best paired with AMD’s AM3 or Intel’s Lynnfield systems. The real magic is in the specifications, however; G.SKILL says the DDR3-1333 and DDR3-1600 kits run at just 1.35V. That’s less than the JEDEC standard of 1.5V, and a whole lot less than the 1.65V and 1.9V kits vendors are pushing for Lynnfield and AM3, respectively. As any good enthusiast knows, parts that run at standard speeds under particularly low voltages often make outstanding overclockers.

Maybe we’re wrong, but the ghost of Mobile Athlon XP past won’t leave us alone. One of these has to be a total baller in disguise:

G.Skill DDR3 1333 4GB (2GBx2) CL9-9-9-24 1.35V

G.Skill DDR3 1333 4GB (2GBx2) CL8-8-8-24 1.35V

G.Skill DDR3 1333 4GB (2GBx2) CL7-7-7-21 1.35V

G.Skill DDR3 1600 4GB (2GBx2) CL9-9-9-24 1.35V

G.Skill DDR3 1600 4GB (2GBx2) CL8-8-8-24 1.35V

G.Skill DDR3 1600 4GB (2GBx2) CL7-8-7-24 1.35V

Memory manufacturer Hynix has unveiled a new line of DDR3 ICs which lowers power consumption by 30%.

The new product operates at 1.5V (volts) power supply as the existing 1Gb DDR3 product and further reduces power consumption by 30% over the existing one. This second generation product is the highest performing memory in the industry among 1Gb density category which is the mainstream of the products.

The new memory is designed to boost battery life for mobile applications which, as we all know, needs serious help.

Digitimes is reporting that memory IC manufacturer Elpida has green-lighted production of 40nm 2Gb DDR3 SDRAM.

The new Elpida 2Gb DDR3 SDRAM uses a smaller chip size to achieve a 44% higher chip yield per wafer compared with the chipmaker’s 50nm DDR3 SDRAM and a 100% yield for DDR3 products that operate at 1.6Gbps, according to the company.

Compared with 50nm products, Elpida said its 40nm 2Gb DDR3 SDRAM uses about two-thirds less current and supports 1.2V/1.35V operation as well as DDR3 standard 1.5V, thus reducing power consumption by as much as 45%.

Despite a small hiccup in July, Elpida has been a consistent provider of some of the world’s fastest DDR3 ICs, such as those found in the ever-growing glut of DDR3-2000 modules. The promise of colder, faster, smaller, lower-voltage DDR3 ICs means 2010 should be a wonderland of cheaper, faster overclocker modules.

Digitimes is reporting that Samsung’s CEO Oh-Hyun Kwon will soon boost the production of DDR3 to bring prices back to reasonable levels.

Supply of DDR3 chips has tightened due to a faster-than-expected pickup in demand, said Kwon, adding that Samsung is gearing up to allocate more capacity to DDR3 output in order to meet the demand. Samsung has ramped chip production using 40nm, which is expected to be its major process technology for 2010, Kwon indicated.

According to recent pricing information from DRAMeXchange, the consumers should expect increasing DDR2 costs throughout the remainder of the year.

The trend reflects increasing demands from PC OEMs moving to cover seasonal demand and the impending launch of Windows 7. Similarly, accelerating migration to DDR3 has put the squeeze on DDR2 supplies to the tune of a price hike.

In the contract market, prices for 2GB DDR2 modules rose 8.5% from September 7 to present. The price of chips has also risen. While this week’s DDR2 prices remain flat, the table below shows an early September hike of nearly 10% on the manufacturer price of 1Gb PC2-6400 chips.

Source: DRAMeXchange

Smaller denominations of DDR3, such as 1GB modules, are however on the decline. It is expected that the larger 2GB modules will follow suit in the new year as DDR3 systems from AMD and Intel become prominent.

Over the past few weeks, AMD has been talking up its enterprise transition to DDR3 in the form of the 12-core Magny-Cours CPU.

AMD has used the multi-part “Playing 20 Questions” series of blog entries to paint the chip’s details. The processor is a dual-die solution that shoehorns two hexa-core Istanbul cores into one package and packs it in with cache and a spider’s web of HyperTransport links.

While a 12-core x86 chip is in and of itself a marvel, it is just one piece of AMD’s big step to embrace DDR3 in the enterprise. It is a move that represents a complete overhaul of AMD’s offerings with new chipsets, sockets, and processors.

San Marino Platform

Taking up the ground floor, the San Marino platform is a 1-2 processor solution for entry-level servers or workstations. Because of the move to DDR3, San Marino adopts the new Socket C32, which includes extra pins for DDR3 memory controllers.

On the processor front, Lisbon will take center-stage throughout 2010 and into the start of 2011. It’s best to consider the chip as a DDR3 version of AMD’s existing Shanghai or Istanbul products with a little optimization sprinkled on top. As the slides indicate, Lisbon will be sold under the AMD 4000 series and will be succeeded by the 32nm Valencia when AMD gets its 32nm production in check.

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While A-DATA is a little-known name in enthusiast circles, maybe their recent DDR3-2200 announcement will turn some heads and open some wallets.

The rather elaborately-dubbed XPG Plus Series DDR3-2200+ v2.0 modules come in 2×1GB and 2×2GB dual channel kits with 8/8/8/24 timings in the 1.65v envelope that Core-series CPUs love.

The particularly observant amongst us will note that XPG Plus Series kits are not tri-channel, which means they’re being prepped for this summer’s Core i5 launch (or AMD’s Socket AM3 standard). Alas. At least they look pretty swank.

OCZ Technology has joined Corsair in halting further production of DDR3 SDRAM modules based on Elpida’s MNH-E Hyper IC.

Corsair announced on Wednesday that DDR3-1866 and DDR3-2000 parts based on Elpida’s Hyper memory chips were suffering an abnormal failure rate. While customers were advised to continue using their products as normal, the firm opted to begin a recall of unsold products in the retail channel.

Rival memory firm OCZ Technology followed suit and announced today that though abnormal failure rates have not been observed, it would nevertheless offer support to customers with failed Elpida-based modules. Effected customers are eligible to receive their choice between an exchange of equal or lesser value or a cash refund.

In regards to the potential issues relating to Elpida Hyper IC’s, OCZ has not yet seen extended failures in the field, and the Elpida Hyper IC’s we have used came from earlier batches so we do not yet know if this is the reason why we are not seeing field issues but as a proactive measure based on the latest information from media reviewers like AnandTech we have officially held the use of any Elpida Hyper IC’s at this time. Any customers that are seeing issues are encouraged to contact us and we will absolutely take care of all customers that with a no questions asked refund or exchange for another OCZ product of equal value, whichever the customer prefers. We want to make sure that our customers have peace of mind and the confidence that we will take care of any and all issues related to modules that utilise Elpida Hyper chips.

Icrontic contacted OCZ for details on the Elpida situation, and we were informed that OCZ customers were at limited risk. We have confirmed that the preponderance of high-speed DDR3 parts from the company uses ICs sourced from companies other than Elpida.

Performance memory manufacturer Corsair has revealed an abnormally high failure rate amongst Elpida MNH-E Hyper DDR3 ICs featured in DDR3-1866 and DDR3-2000 kits from many of today’s biggest names in performance DRAM.

We have seen a number of reports across various forums about failures of modules (from Corsair as well as from other memory manufacturers) built with Elpida “Hyper” RAMs. Through lab testing, we have now been able to reproduce similar failures. We are continuing to test to determine the cause of these failures. Note that although a relatively small percentage of “Hyper” ICs appear to be affected, the rate of failure is not acceptable to Corsair or to our customers.

Existing owners of the afflicted Corsair products (TW3X4G1600C6GTF, TR3X6G1866C7GTF, TR3X6G2000C8GTF, TR3X3G2000C7GTF, and TR3X6G2000C7GTF kits) are advised to continue using their memory as usual. In the interim, Corsair is recalling stocks of these products from retailers until the trouble is resolved.

It is not yet known how other manufacturers will respond to this issue, but we can confirm that Elpida Hyper ICs are present in OCZ, G.SKILL and Kingston modules. As an alternative, DDR3 manufacturers can continue DDR3-2000 production with Micron D9GTR and Samsung HCF0 chips.

UPDATE 7/10/2009, 1:04 PM: Hexus.net has flagged Corsair down to learn more about the Hyper issues in a short interview.

Brandtaxtic memory outfit Corsair has just unleashed extended cooling fins for DDR3 modules kitted with the firm’s Dual-path Heat Xchange (DHX) tech. The new hunks of metal promise better cooling while the GT version is coated in space-age marketing bullshit Corsair has dubbed a “phase–change thermally conductive polymer coating.”

The official Corsair store now offers the goods starting at $19.99 for black, or an extra five bones for the honor of red pai– er, phase-change thermally conductive polymer coating.

Baller, shot-caller, 20" blades on the Impala

MadShrimps tests eight mid-range DDR3 memory kits for X58 motherboards.