
Thermaltake SpinQ (image courtesy of Thermaltake.com)
Thermaltake has been with us since 1999 and has served to provide enthusiasts with some of the most well-known and accessible cases, fans and heatsinks on the market. For many of us, our first foray into computer building and modification included a Thermaltake product like the old Dragon Orb or Volcano heatsinks, Crystal Orb chipset/VGA cooler, or the Smart Fan circa 2001. Always functional and eye-catching, it’s easy to see why Thermaltake products have been bringing aftermarket to the mass market for a decade.
In late 2008, Thermaltake announced the coming of the SpinQ heatsink which promised a new take on their prior orb designs. Through the use of six heatpipes and 50 cooling fins, the orb’s traditionally tall cylinder cooling structure could be laid on its side and fitted with a centrifugal fan to exhaust heat outward from the unit. The novel unit’s unique approach to cooling has garnered several awards including the CES Innovations 2009 Design and Engineering Award and the prestigious 2009 design awards from RedDot and the International Forum Design in Germany.
We’re happy to have this unique heatsink here at Icrontic for testing to see how well Thermaltake has married performance with aesthetics.
Specs
- Compatibility: Socket 775, Socket 1366, Socket 754, Socket 930, and Sockets AM2/2+/3
- Heatsink Dimension: 121.63(L) x 90(W) x 151.85(H) mm
- Heatsink Material: 50 Aluminum Fins w/ Copper Heatpipes & Base
- Heatpipe: 6 mm x 6
- Fan Dimension: 80 x 85 mm
- Fan Speed: 1,000 ~ 1,600 RPM
- Bearing Type: Sleeve
- Noise Level: 19 ~ 28 dBA
- Max. Air Flow: 86.5 CFM
- Max. Air Pressure: 2.22 mmH2O
- Rated Voltage: 12 V
- Started Voltage: 7 V
- Rated Current: 0.45 A
- Power Input: 5.4 W
- MTBF: 50,000 Hours
- Weight: 667 g
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