I'm not saying die shrinks are not important. They obviously are critical to processor design, reduce current leakage, increase efficiency, reduce heat output, normally improve frequency.

The point I am making is saying that one or the other go to a certain nm process first, while great for them, its hardly an innovation. They are both chasing each other to shrink, its part of the design paradigm, die shrinks are good, everyone knows it. Important as hell, yes, an innovation in design, not really.

Mildly off topic, but not really. Watch this video. This to me is the future of benchmarking reviews for whoever can get it right. Direct side by side A/B comparison in video, real time. That tells a story greater than any screen grab from XS ever could.

http://blogs.amd.com/work/2009/04/22...ary-press-kit/