Mirage,

As far as current leakage goes, it would generally hold true for the die shrink, but your right, when they hit 45nm, the space between transistors got so small that they needed to innovate using SOI, so good point.

Still, point I am making, Die shrinks are something they are each chasing each other on. Its not a secret that its something that each firm wants to do for various reasons / cost/efficiency/product improvements.