Breakthrough Promises Hotter, Tougher, Faster Chips
Powerful processors that run hot, but need no cooling, and devices capable of withstanding extreme environments may be the result of new research.
Source: ZDNetResearchers led by Daisuke Nakamura of Toyota Central R&D Laboratories of Aichi, Japan, have described a way to build up wafers of silicon carbide, SiC, with a very low number of defects--an essential step in mass-producing electronic devices from the compound, the science journal Nature reported on Thursday. The researchers said it may be up to six years before the process is commercialized. The new process involves building up layers of SiC from a high-temperature gas, which allows the crystallization of the compound to happen only on the cleanest faces. By this method, the researchers said, wafers can be made with lower levels of defects--by factors of two to three times less.
0
Comments
I'm going to give a shot at answering this but I'm really not a great expert. The process of making artificial diamond involves sublimating a hot gas (acetylene) onto the surface of a catalyst, but it doesn't grow in a controllable/predictable fashion. It's kind of like trying to paint your initials onto a 3x5 note card with a can of your favorite brand of over-the-counter spraypaint.
Check out this article about what IBM's been working on in the way of nano-scale research: http://www.eetimes.com/at/hpm/news/showArticle.jhtml?articleId=18310384&kc=6380
20nm baby!
-drasnor