Intel to build 300mm fab in China
Winga
MrSouth Africa Icrontian
Intel has officially announced plans to build a 300mm wafer fabrication facility in the city of Dalian in northern China.
The factory, which has been dubbed Fab 68, will the first wafer fab Intel is building, from the ground up and at a new location, in 15 years. At a cost of $2.5 billion (US) it will be one of the most significant investments Intel has made in China, bringing Intel’s total stake in China to just under $4 billion.
CEO Paul Otellini acknowledged China as their fastest growing market and believes it's critical to invest in markets that will sustain growth to better serve their customers.
Construction of the plant is scheduled to begin later in the year with production expected to start some time in 2010. Initially, the fab will produce chipsets that support Intel's core microprocessor business.
When Fab 68 comes on line in 2010, it will be one of eight 300mm factories built by Intel and the first built in Asia. Other fabs are located in Ireland, Israel and the USA. 300mm wafers can be produced at much lower cost and uses less resources than the more common 200mm (eight-inch) wafers.
The factory, which has been dubbed Fab 68, will the first wafer fab Intel is building, from the ground up and at a new location, in 15 years. At a cost of $2.5 billion (US) it will be one of the most significant investments Intel has made in China, bringing Intel’s total stake in China to just under $4 billion.
CEO Paul Otellini acknowledged China as their fastest growing market and believes it's critical to invest in markets that will sustain growth to better serve their customers.
Construction of the plant is scheduled to begin later in the year with production expected to start some time in 2010. Initially, the fab will produce chipsets that support Intel's core microprocessor business.
When Fab 68 comes on line in 2010, it will be one of eight 300mm factories built by Intel and the first built in Asia. Other fabs are located in Ireland, Israel and the USA. 300mm wafers can be produced at much lower cost and uses less resources than the more common 200mm (eight-inch) wafers.
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