OCZ Cryo-Z updated for LGA1156/1366

ThraxThrax 🐌Austin, TX Icrontian
edited May 2011 in Science & Tech
OCZ Cryo-Z updated for LGA1156/1366

Comments

  • timuchantimuchan Fishers, IN Icrontian
    edited December 2009
    I'm curious, does use of this during higher-humidity times of the year lead to condensation of the cooling block?
  • ThraxThrax 🐌 Austin, TX Icrontian
    edited December 2009
    Condensation is always a concern when using a phase change cooling like the Cryo-Z or Prometia Mach II. That said, there are several ways to effectively combat the condensation: Foam gaskets around the CPU socket and behind the motherboard, and dielectric grease can effectively insulate the motherboard from moisture. The Cryo-Z, for its part, has a sealed evap head which also manages condensation very well.
  • BuddyJBuddyJ Dept. of Propaganda OKC Icrontian
    edited December 2009
    Do want. I always thought they were more expensive than this.
  • VicarVicar Icrontian
    edited December 2009
    Intresting concept, how safe is it to use in day to day use? Any one using this in their rig?
  • ThraxThrax 🐌 Austin, TX Icrontian
    edited December 2009
    Vicar: The Cryo-Z and other units like it are designed for 24/7 usage. The market has had technology at various price points for about a decade, starting with the Asetek VapoChill in 1999.

    These units are designed for 24/7 operation and--provided the directions are followed to the letter--are quite safe to use.
  • VicarVicar Icrontian
    edited December 2009
    Thanks for the info. Looking at the review @ skinnee labs, it was just about oc and not everyday use. Looks like a great piece of kit. I won't mind getting my hands on one.
  • Cath Princeton
    edited December 2009
    Sounds great with the price tag.
  • liu
    edited May 2011
    My new installed a ocz - cryo - z, but it can not work normally, CPU socket on the back of the material my installing sequence is: will first foam glued to the motherboard back CPU socket (back) position, then will clip installed in the mainboard already clamped on the back of foam, then will heat conduction silk glued splint it, I want to know my installing sequence is there a problem? In addition I now use process compressed chance every once in a while, as if is to launch a vibration, the signs of but later it hasn't can not work normally. Who can help me to answer it?
  • ThraxThrax 🐌 Austin, TX Icrontian
    edited May 2011
    The official OCZ support forums: http://ocztechnology.com.
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