By the time die shrinks get down to 11 nm, if graphene or some other material is not yet economically viable, we may have to finally accept the fact that multicore cpus and their speeds have gotten as good as they are going to get.
With the speeds and power efficiencies we already have at 45 nm and 32 nm, no one should be complaining by the time we get down to 11 nm.
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With the speeds and power efficiencies we already have at 45 nm and 32 nm, no one should be complaining by the time we get down to 11 nm.
I work for Cree, Inc. I kinda know a little (OK, a fair amount) about SiC substrates and epitaxy.
YGPM;)
@thrax Thank you sir!