Samsung yesterday announced that it has begun supplying limited quantities of 32GB DDR3 modules to partners for evaluation.
Based on the company’s cutting-edge 40nm-class 512MB DRAM ICs, each module contains 32 such chips running at DDR3-1066 and a low voltage of just 1.35V. Intended for servers, the new modules are registered to permit higher memory capacities without compromising the stability of the system or unduly stressing the system’s memory controller.
“Samsung continues to set the pace in advanced memory for high-end server applications by offering 40nm-class 32GB memory modules to reach previously unattainable levels of system capacity,” said Soo-In Cho, President and GM of Samsung Electronics’ Memory Division. “In just 10 months, Samsung has now secured the best competitive advantage with the broadest portfolio of 40nm-class DDR3 based memory solutions in the industry since the 40nm-class DRAM was first produced last July.”
Mass production of the new modules is expected to begin in early April, with a retail release not far behind.



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