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Thermalright Venomous X pictured

Thermalright Venomous X pictured

Thermalright_Venomous_X_02After several days of teasing users with the silhouette of a tower heatsink, EXPreview has begun to provide details on the next-gen unit Thermalright has designed to succeed the legendary Ultra-120 Extreme.

Dubbed the Venomous X, the new cooler measures 125x158x160 (DxWxH) and has a fanless weight of 755g. The unit features six 6mm heatpipes, a nickel-plated copper base, and aluminum fins with bent winglets designed to improve airflow with both high and low-CFM fans. The company has also increased the distance between the fins to 1.9mm to reduce the amount of back pressure created between the fins in high-CFM scenarios.

Rounding out the features, the Venomous X has a new “Pressure Vault Bracket” that can adjust downforce from 40-70 pounds and a slightly convex mirrored base which, Thermalright claims, will more effectively draw heat away from the center of the chip.

While we do not yet have any hard numbers, Thermalright has tellingly said that it is keeping hexa core chips in mind with the new design. Compatible with LGA775, LGA1156 and LGA1366, the TVX will soon debut for about $60 without fan.

Comments

  1. mirage
    mirage I have not seen any lapped TRUE cooling worse than the original. Not again Thermalright, I don't want the convex base.
  2. Thrax
    Thrax A convex base puts extra pressure on the center of the CPU where the dies are, ensuring superior contact. Old heatsinks were con<i>cave</i>, which is very different.
  3. mirage
    mirage
    Thrax wrote:
    A convex base puts extra pressure on the center of the CPU where the dies are, ensuring superior contact. Old heatsinks were con<i>cave</i>, which is very different.

    I had a convex one like others. See at the links below
    http://www.cryo-laboratory.com/forums/reviews-guides/67789-thermalright-ultra-120-extreme-review.html
    heatsinkflatnesssized.jpg

    See another one here
    1000352v.jpg

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