Toshiba Corp. announced this week the launch of a 64GB (gigabyte) embedded NAND module, the highest capacity yet achieved in the industry.
The new chip is the flagship part in an array of six new embedded NAND products that offer complete compliance with the e-MMC standard, or a category of memory products ideal for use in smartphones, netbooks and digital cameras.
The new 64GB e-MMC device combines 16x32Gbit (four gigabyte) NAND chips fabricated on Toshiba’s 32nm process and bundles them with a dedicated controller. This configuration, Toshiba says, is the first of its kind and was achieved via the company’s advanced thinning and layering techniques to produce chips that are only 30 micrometers thick.
The product’s full compliance with the JEDEC/MMCA Version 4.4 standard simplifies integration for downstream suppliers by providing a standard interface for the embedded MultiMediaCard device.
“The e-MMC™ interface has become the most widely embraced embedded NAND solution with a built-in controller to simplify integration into system designs. With the addition of higher density, Ver 4.4 e-MMC™ compliant product offered as single package solutions or as part of a multi-chip module combined with DRAM, Toshiba can help designers reduce memory subsystem space requirements,” said Scott Beekman, business development manager, mobile communications memory for TAEC.
In addition to the 64GB package, the company’s lineup of new embedded modules includes 2GB, 4GB, 16GB and 32GB parts which will begin mass production in the 1H of 2010 at a rate of 3 million per month combined.
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