AMD's 90nm Processors to Dissipate 105W?
BlackHawk
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Source: X-bit labs.comWhile Intel Corporation ran into very serious heat dissipation issues with its NetBurst architecture CPUs and 90nm strained silicon technology, looks like its arch rival AMD will also have some hot chips in future.
Sources close to AMD’s partners said the company is going to employ some new power requirements for mainboards designed to support future AMD64 processors, such as Athlon 64 4000+ and the Athlon 64 FX-55, both most probably to be made using 90nm technology. Changes are necessary for mainboards set to come in the second half of 2004.
According to currently available details, maximum current (IDD) of future 64-bit processors from AMD will be 80A, while maximum thermal power will be 105W. These are mandatory requirements for mainboards in the second half of the year. The requirements are only for Socket 939 mainboards, as 754-pin and 940-pin products have very limited future, as AMD roadmap for 2004 revealed.
Apparently, AMD’s 90nm chips will have Vcore at 1.20V – 1.35V, in contrast to current core voltage of 1.40 – 1.55V for 64-bit chips. The first 90nm chips are expected to hit 2.60GHz, but AMD currently does not specify the top speed bin for its new CPUs.
Intel's Prescott 3.60GHz processors are expected to dissipate up to 103W of heat early next year.
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A SLK-900A with the right fan can handle in excess of 150w of heat; I see no problem with this. Actually, it is a good thing in some ways.
Why? As CPUs get hotter, you need either more surface area or higher airflow to keep them at the same temperature. Sooner or later, big OEMs such as Dell won't be able to use standard HSFs because the fans would be too noisy, or the heatsink too big. So, they'll switch to one (or both) of two things: watercooling or heatpipes. Dell is actually using the latter already, but they (as usual) screwed up the design, so they don't work properly.
But, eventually this will force heatpipes and watercooling into the mainstream market, which is a good thing.
Heatpipes? Yes, possible so. Watercooling mainstream? I seriously doubt it. That's just just over the top for mass production.
Size- you cannot fit a water pump in a laptop. I've taken the damn things apart, and there is no room in there for a pump, so the laptops would have to be bigger
Portability- water is heavy (8lbs/gallon)
Power- a water pump would kill battery life
A water cooling system that a normal person could work on would be dead easy to do; the reason on one has done it yet is that there is no demand for it. You can even use off the shelf parts; Leo, are you familiar with QDs (Quick Disconnect valves)?
Everything that you haven't tested or don't have in your possession isn't all worthless.
That 40mm fan pushes <10cfm.
Most likely, it does very little (if anything) in the way of aiding cooling, and may in fact, harm it. How? That damn big duct is right next to the heatsink. If it interferes with airflow sufficiently, it will be more of a hindrance than a help.
So Mackanz, you're right... just because I haven't tested it doesn't make it worthless. However, I can arrive at some logical conclusions based on what I know about something. And, IMO, I know enough about air cooling that I can make a fairly good determination of what works and what doesn't. This doesn't look to me like it works all that well. It may very well work better than I think it does, but I tend to doubt it.
I'll have to wait until I get ahold of one of the boards (if I do) to test that, though.
It shows that manufacturers are finally beginning to take the infant steps into cooling warm-running chips and circuits that haven't received that form of attention before.
Each step along the lines of the OTES system is a baby-step in the direction the industry needs to go.. System-wide cooling, not just localized component cooling.
It's a symbolic step, even if it isn't a very good one when it comes to actual application.