Via Technologies has provided a glimpse of features that will be offered with the company’s upcoming next-generation processor core, called Esther.
The first Esther-based processors from Via are expected to be available during the second half of the year. Optimized for security and e-commerce applications, the chips will be manufactured at IBM’s 300-millimeter wafer fabrication plant in East Fishkill, New York, using a 90-nanometer process.
Check out the low power consumption of these chips. -KingFish
Source: PCWorld
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